The USB 3.0 Promoter Group has announced that it has completed work on USB 3.1. This new connectivity standard will offer SuperSpeed USB to offer transfer speeds of up to 10 Gbps.


In a press statement company has stated that :-

“SuperSpeed USB 10 Gbps uses a more efficient data encoding and will deliver more than twice the effective data through-put performance of existing SuperSpeed USB over enhanced, fully backward compatible USB connectors and cables. Compatibility is assured with existing USB 3.0 software stacks and device class protocols as well as with existing 5Gbps hubs and devices and USB 2.0 products”

You should note that USB 3.0 offers transfer speed up to 5 GBPS, As USB 3.0 is backward compatible, similar USB 3.1 will also be backward compatible with device like USB 2.0.

“The USB 3.1 specification primarily extends existing USB 3.0 protocol and hub operation
for speed scaling along with defining the next higher physical layer speed as 10 Gbps,” said
Brad Saunders, USB 3.0 Promoter Group Chairman. “The specification team worked hard to
make sure that the changes made to support higher speeds were limited and remained
consistent with existing USB 3.0 architecture to ease product development.”

After this announcement, chip makers like AMD and Intel can start work on new chips which supports new USB 3.1.

“We recognize this advancement in USB technology is an important development for our
customers,” said Tom Bonola, Chief Technology Officer, Business PC Solutions, HP. “The
USB 3.1 Specification enables us to meet the growing needs of our customers for faster
data transfer while maintaining backwards compatibility with existing devices.”

“The industry has affirmed the strong demand for higher through-put, for user-connected
peripherals and docks, by coming together to produce a quality SuperSpeed USB 10 Gbps
specification,” said Alex Peleg, Vice President, Intel Architecture Group. “Intel is fully
committed to deliver on this request.”

We can expect first USB 3.1 compatible device to be announced by late 2014


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