Its not a long time when Huawei has launched its Ascend P7 and now it seems Chinese vendor is already working on its successor, the Ascend P8. Recently spec sheet of this alleged device surfaced online which shows what this device has got. This Ascend P8 will be much similar to be of Ascend p7, the premium device and might come with metal body.
As per the leaked specs sheet, Huawei Ascend P8 will have 5.2 inch of full HD screen with screen resolution of 1920×1080 pixels and pixel density of 424ppi, display has “2.5D” tapered edges as well, under the hood it will be powered by a 16nm FinFET Huawei Kirin 930 SoC manufactured by TSMC, but we have our doubts as some reports suggest that those processor will not go under production until 2015.
The blurry image suggest that there could be a fingerprint scanner at back or it could be a dual LED flash or both. Reports suggest that Huawei has used expensive material to build this device including metal with a “porcelain texture” back cover, and ceramic buttons.
Huawei is expected to showcase this device in CES aka Consumer Electronic Show 2015 which is schedule for January and it could be priced somewhere around 2,999 CNY ($490).